| 发明名称 |
KUEHLANORDNUNG FUER ELEKTRISCHE BAUTEILE |
| 摘要 |
In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block. |
| 申请公布号 |
DE2706165(A1) |
申请公布日期 |
1977.08.18 |
| 申请号 |
DE19772706165 |
申请日期 |
1977.02.14 |
| 申请人 |
SONY CORP. |
发明人 |
ARII,HIROSHI;KAWADA,HIROHITO;YOSHIDA,TAKASHI;NONAKA,CHIAKI |
| 分类号 |
H05K7/20;F28D15/02;H01L23/40;H01L23/427 |
主分类号 |
H05K7/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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