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发明名称
Electroless copper plating bath
摘要
An electroless copper plating bath comprising a copper salt, a chelating agent, an alkali pH adjusting agent, formaldehyde, and sodium hypophosphite as a plating rate accelerator.
申请公布号
US4036651(A)
申请公布日期
1977.07.19
申请号
US19740445968
申请日期
1974.02.26
申请人
RCA CORPORATION
发明人
WEINER, JOEL ALAN
分类号
C23C18/40;(IPC1-7):C23C3/02
主分类号
C23C18/40
代理机构
代理人
主权项
地址
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