发明名称 |
Cooling device for electric device |
摘要 |
A semiconductor device is carried in compressive contact relationship between two vapor cooling containers put in fluid communication with condensers disposed above them through connection tubes respectively. A condensible liquid coolant fully fills each container, and the associated connection tube and partly fills the mating condenser. One auxiliary tube is disposed within each connection tube and has a bent upper end opening in the associated condenser below the liquid surface of the coolant and a lower end opening in the associated cooling container connected thereto.
|
申请公布号 |
US4036291(A) |
申请公布日期 |
1977.07.19 |
申请号 |
US19750559393 |
申请日期 |
1975.03.17 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KOBAYASHI, GAI;SHIKANO, YOSHIRO |
分类号 |
F25D9/00;G12B15/02;H01L23/427;H02M7/04;(IPC1-7):H01L23/42 |
主分类号 |
F25D9/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|