Mfr. of mesa diodes - uses deposition and surface erosion to avoid deterioration resulting from thermocompression

摘要

The mfr. of Mesa type diodes overcomes deterioration due to thermo compression etc. The stages of mfr. include creating the basic mesa form on a material having a high heat conductivity such as copper or molybdenum or a low resistivity doped silicon material. The mesa form is regular across the surface, deposition in the hollows and surface erosion produces a plane parallel surface which is provided with a metal conducting layer over the active area. The support points form a continuous line around the axis of the principle mesa, the diode and supports forming a triangle whose centre coincides with that of the substrate.