发明名称 Hard soldering for mfg. delay lines or waveguides - using gold foil to obtain vacuum tight joint
摘要 <p>A vacuum-tight hard solder joint is made between two metal parts where at least the two joint surfaces are made of copper. The hard solder is a gold foil. This is placed between the two joint surfaces, and then the two parts are pressed together and soldered at 935-985 degrees C, esp. 940-980 degrees C. When multiple stepped soldering is employed, a gold foil is pref. used for at least the first two joints, the first joint being made at 975-985 degrees C, esp. 980 degrees C and the second joint being made at 955-965 degrees C, esp. 960 degrees C. The metal parts and the Au foil are pref. placed in a solder mould before heating. The Au foil is pref. 5-20 mu m thick, esp. 10 mu m thick. This soldering process is pref. applied to delay lines for travelling wave tubes, or to wave guides, esp. hollow parts. The joints are always vacuum-tight.</p>
申请公布号 DE2628345(B1) 申请公布日期 1977.07.14
申请号 DE19762628345 申请日期 1976.06.24
申请人 SIEMENS AG 发明人 ACHTER EUGEN
分类号 B23K1/00;B23K35/30;(IPC1-7):23K1/04 主分类号 B23K1/00
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