| 摘要 |
A microcomputer board has a first section with fixedly mounted microcomputer components interconnected by a printed circuit, and a second section having unconnected wire-wrap terminals adapted to receive DIP components. Wire-wrap terminals are provided for interconnecting the printed circuit with the wire-wrap section of the board, and additional wire-wrap terminals are provided for I/O connections. A ground plane extends between the wire-wrap connectors, on one side of the board, and voltage planes extend between the wire-wrap terminals on the other side of the board. Wire-wrap terminals may be provided in the wire-wrap section of the board and connected to the voltage and ground planes.
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