发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS
摘要 PURPOSE:When metallix foil lead wire formed on flexible electric insualting tape extending in longitudinal direction is adhered tightly with metallic contact section formed on semiconductor pellet, metallic foil lead wire is supported at both sides. In this method, deformation is minimized, and junction with metallic contact section can be performed at correct position.
申请公布号 JPS5269564(A) 申请公布日期 1977.06.09
申请号 JP19750146059 申请日期 1975.12.08
申请人 SUWA SEIKOSHA KK 发明人 HAYASHI YOSHIHARU
分类号 H01L21/60;H01L23/12;H01L23/48 主分类号 H01L21/60
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