发明名称 Apparatus for preparing electronic component wire leads preliminary to mounting the components on circuit boards
摘要 An apparatus to prepare electronic wire leads for insertion into the holes of printed circuit boards comprises receiving means for receiving the leads, clamping means to clamp the leads into the receiving means, cutting means to cut the leads to a desired length, bending means to bend the terminal portions of the leads to a selected angle, holding means to hold the leads during the bending, and squeezing means further to bend the terminal portion of the leads and squeeze them to a predetermined position relative the remaining portion of the leads. Linkage means interconnect all of the operative elements of the apparatus for single-stepped, timed, sequential operation.
申请公布号 US4026333(A) 申请公布日期 1977.05.31
申请号 US19750612951 申请日期 1975.09.12
申请人 VENTURES UNLIMITED CORPORATION 发明人 KELLER, RAY V.
分类号 H05K13/02;(IPC1-7):B21F45/00 主分类号 H05K13/02
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