发明名称 WIRE BONDING APPARATUS
摘要 PURPOSE:To obtain a wire bonding apparatus which can eliminate an irregularity in a timing aspect and which can secure a stable stop position by installing a motor-driven stop means which turns off an output of a driving motor when an input of a lower-end sensor of a lead-frame holding-down part is taken in. CONSTITUTION:When a lead frame 23 is conveyed to a bonding point, a CPU 1 gives a reset output signal 8a to a flip-flop circuit 11 and a flip-flop output signal 12a is held at a high level. A motor output signal 5a is turned on and an induction motor 3 is driven. At this stage, when a lead-frame holding-down part is lowered and a sensor input signal 4a is input, the flip-flop output signal 12a is changed over from the high level to a low level and a signal is given to a one-shot circuit 13. At this time, a brake output signal 10s is turned on only for a duration which is set by a resistance R and a capacitor C, which are connected externally, from a one-shot circuit 13; the induction motor 3 is braked and the revolution is stopped.
申请公布号 JPH0377336(A) 申请公布日期 1991.04.02
申请号 JP19890213647 申请日期 1989.08.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAWABATA KAZUHIRO;YOSHITOMI KIYOTAKA
分类号 H01L21/60 主分类号 H01L21/60
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