发明名称 PROCESSO E SOLUZIONE PER LA SENSIBILIZZAZIONE DI SUBSTRATI PER LA DEPOSIZIONE DI METALLO SENZA ELETTRICITA
摘要 1397091 Sensitization of substrates KOLLMORGEN CORP 28 July 1972 [29 July 1971] 35320/72 Heading C7F In sensitizing an insulating base, the base is first contacted with a solution of a reducible metal salt and a secondary reducing agent which is incapable of reducing the metal salt at the pH of the solution, and then contacted with a solution of a primary reducing agent to effect the reduction. The metal salt may be cupric acetate, cupric nitrate, cupric sulphate, nickel sulphate, nickelous chloride, cobaltous acetate or ferrous sulphate. The secondary reducer may be formaldehyde, paraformaldehyde, trioxane, glyoxal, dimethylhydantoin or trioxymethylene. The salt solution may also contain a complexing agent selected from Rochelle salt, salts of aminoalkanoic acids, salts of nitrilotriacetic acid, gluconic acid and gluconates and alkanolamines; and a metal accelerator selected from compounds of Ag, Pd, Au, Hg, SnCl 2 , CoCl 2 NiCl 2 and ZnCl 2 The primary reducer comprises a solution of a borohydride, a substituted borohydride, or an amine borane. Suitable solvents for the metal salt include water, dimethyl formamide, methanol, ethyl acetate, acetone, n-butanol, and 1,1,1-trichloroethylene. The treated base is subsequently electrolessly plated, e.g. with Cu.
申请公布号 IT961765(B) 申请公布日期 1973.12.10
申请号 IT19720051858 申请日期 1972.07.29
申请人 KOLLMORGEN CORP 发明人 NUZZI F;POLICHETTE J
分类号 C04B41/88;C03C17/10;C23C18/16;C23C18/18;C23C18/20;C23C18/26;C23C18/28;C23C18/30;C23C18/31;C23C18/34;C23C18/40;C23C18/44;D06Q1/04;H05K3/18;(IPC1-7):C23C/ 主分类号 C04B41/88
代理机构 代理人
主权项
地址