| 发明名称 |
PRODUCTION OF SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To install Si semiconductor pellets to frame mounted portions without destructing them by beforehand annealing lead frames of copper alloy as specified. |
| 申请公布号 |
JPS5253662(A) |
申请公布日期 |
1977.04.30 |
| 申请号 |
JP19750129240 |
申请日期 |
1975.10.29 |
| 申请人 |
HITACHI LTD |
发明人 |
OKIKAWA SUSUMU;YUGAWA OSAMU;MIKINO HIROSHI;NONAKA YOSHIO |
| 分类号 |
H01L21/52;H01L21/58;H01L23/50 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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