| 摘要 |
A method and apparatus for dip-soldering semiconductor components is disclosed as including a temperature-controlled solder bath and a gas supply line disposed along one edge of the upper surface of the bath. Hydrogen and nitrogen gases are selectively supplied and discharged from nozzles of the supply line by means of a two-way control valve, and the supply line is vertically, horizontally, and rotatably adjustable with respect to the bath container and the bath surface so as to precisely locate the position of the gas nozzles with respect thereto.
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