发明名称 |
Epoxy composition for encasing semiconductor devices |
摘要 |
An epoxy resin composition for encasing semiconductive devices comprising a homogeneous mixture of a cresol novolak type epoxy resin and phthalic anhydride as a curing agent, the amount of phthalic anhydride being in excess of the equivalents of epoxide groups, a derivative of imidazole as a curing accelerating agent, and remainder being mineral filler.
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申请公布号 |
US4013612(A) |
申请公布日期 |
1977.03.22 |
申请号 |
US19750622729 |
申请日期 |
1975.10.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAMURA, TOORU;OJIMA, NOBUYUKI;KONDO, SIGERU;YOZO, JIZODO |
分类号 |
H01L23/29;(IPC1-7):C08L63/04 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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