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发明名称
SEMICONDUCTOR MANUFACTURING PROCESS
摘要
<p>PURPOSE:To use different adhesive to stick a semiconductor wafer to a support and to a mask to perform each separation process individually, thus easing the selection after the separation process.</p>
申请公布号
JPS5227267(A)
申请公布日期
1977.03.01
申请号
JP19750103160
申请日期
1975.08.25
申请人
SHIN NIPPON DENKI KK
发明人
KACHI MASAO;FUKUDA KUNIYOSHI
分类号
H01L21/301;H01L21/302
主分类号
H01L21/301
代理机构
代理人
主权项
地址
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