| 摘要 |
<p>PURPOSE: To provide slurry for polishing suitable for the flattening of an interlayer insulating film by organic resin, and the manufacture of a semiconductor device using this. CONSTITUTION: This is a slurry for polishing being used when flattening the interlayer insulating film of a semiconductor device by polishing, and is slurry for polishing where aqueous inorganic compound fine particles are dispersed in a nonaqueous dispersed solvent. This is the manufacture of a semiconductor device, which is equipped with a process of forming an interlayer insulating film 14 on a substrate 13, where a step is made on the surface, such that it covers the step, using an organic resin, and a process of flattening the interlayer insulating film 14 by polishing it, using slurry for polishing. As the slurry for polishing, a slurry where aqueous inorganic compound fine particles are dispersed in a nonaqueous dispersed solvent is used.</p> |
