| 摘要 |
PURPOSE: To provide a method of laminating a sheet circuit board, which manufactures a multilayered board with a high yield, and a sheet circuit board laminating device. CONSTITUTION: A base board 200, which is used as a base material for forming a multilayered board 107, is sent by a conveyer line 101 in the direction of the Y-axis. Each one part of tape-shaped prepregs 400 and circuits 202 on tape- shaped boards 300 are cut out while the prepregs 400 and the tape-shaped boards 300 are sent by laminating units 102 and 103 in the direction vertical to the feeding direction of the board 200 and these of the prepregs 400 and the boards 300 are laminated on a circuit 201 on the board 200, which is sent by the conveyer line 101. The laminated part formed on the circuit 201 on the board 200 is heated being pressed by a press unit to make the prepreg 400 and the boards 300 bond together and this laminated part is cut out from a base board 106 as the board 107 by a board cutting unit. |
