| 摘要 |
PROBLEM TO BE SOLVED: To arrange a via hole to be located away from an active element, without increasing the ground inductance of the active element. SOLUTION: A common terminal 12 of an active element 11 is connected to a ground conductor 13 of a coplanar line, and an input terminal 14 and an output terminal 15 are connected to signal conductors 16 and 17 of the coplanar line. The signal conductors 16 and 17 of the coplanar line are connected to signal conductors 19 and 20 of a microstrip line by a connecting part 18 away from the active element 11. Also, a ground conductor 13 of the coplanar line is connected through a via hole 22, formed on the connecting part 18 to a ground conductor 23 of the microstrip line on the rear side of a semiconductor wafer 21. Thus, the distance from the active element 11 to the via hole 22 is enlarged, while maintaining increase in the ground inductance comparatively low, and the lowering of production yield in the formation of the via hole 22 is prevented. |
