| 摘要 |
PURPOSE: An image pickup device and an image pickup lens are provided to reduce manufacturing costs and the number of parts. CONSTITUTION: An image pickup unit is composed of image pickup element(2b) such as CMOS(Complementary Metal Oxide Semiconductor) type image sensor. A bottom surface of rectangular sheet-shaped image pickup element(2b) is stuck on the upper surface of base board PC. At the center of the upper surface of the image pickup element(2b), there is formed a photoelectrically-converting section(2d) on which pixels are arranged two-dimensionally, and peripheral surface(2a) wherein an image processing circuit structured in image pickup element(2b) and inside thereof is formed around the photoelectrically-converting section. In the vicinity of an outer edge of the peripheral surface(2a) that crosses a thin side face at right angles, there are arranged many pads(2c). |
