| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive resin sheet excellent in thermal conductivity, heat resistance and adhesive strength; and a thermosetting resin composition providing a resin insulating substrate.SOLUTION: A thermosetting resin composition contains an epoxy resin, a phenol curing agent, a self-polymerization reaction accelerator of the epoxy resin, a phenoxy resin having a weight average molecular weight of 10,000 or more, and a highly thermoconductive inorganic filler. A functional group of the phenol curing agent is in a range of 0.2-0.8 equivalent with respect to 1 equivalent of the epoxy group in the total epoxy resin.SELECTED DRAWING: None |
