DEVICE AND METHOD FOR PROCESSING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a device and a method for processing a substrate capable of nicely removing unwanted substance from the peripheral rim of a substrate surface through etching in spite of the nature of the unwanted substance adhered to the substrate.

SOLUTION: The device for processing the substrate is provided with a first etching mode wherein a first nozzle 3 is positioned at a processing position P31 to supply chemical solution from the first nozzle 3 to the surface peripheral rim TR of the turning substrate W; and a second etching mode wherein a second nozzle 4 is positioned at a processing position P41 to supply DIW to the surface peripheral rim TR to the place where the chemical solution is adhered, while supplying the chemical solution from the first nozzle 3 positioned at the processing position P31 to the surface rim part TR whereby the etching mode is switched selectively between two etching modes, in accordance with the nature of a thin film adhered to the substrate W.

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