| 摘要 |
PROBLEM TO BE SOLVED: To provide an operation method of an inspection apparatus.SOLUTION: An operation method of an inspection apparatus applied to a semiconductor inspection apparatus having a needle is provided. The method includes a step for displaying a wafer image in a touch panel display, a step for detecting a touch signal generated from the touch panel display, a step for detecting the magnification of the wafer image at the time of touch signal generation, and a step for determining the travel speed of the needle by the magnification of the wafer image at the time of touch signal generation. Furthermore, direction of movement of the needle can be determined by the touch signal. The operator can operate each needle in the semiconductor inspection apparatus more intuitively.SELECTED DRAWING: Figure 1 |
