| 摘要 |
A printed circuit comprising a substrate, a first conductive circuit pattern thereon and an insulator on the first conductive circuit pattern. The insulator has a via hole which extends down to and is tapered toward the first conductive circuit pattern. A second conductive circuit pattern is formed on the side wall of the via hole and on a portion of the first conductive circuit pattern. The tapered via hole allows the second conductive circuit pattern to ensure excellent electrical contact with the first conductive circuit pattern. |
