| 摘要 |
PURPOSE:To form a conductive film equipped with a plurality of thicknesses through a single film forming process by installing a mask having a plurality of openings in proximity to the front surface of the film forming surface of a base board to be provided with film, forming conductive film on this base board through the mask, and varying the ratio of opening in a certain region from other regions. CONSTITUTION:A mesh-form hard mask 2 is installed ahead the film forming surface of a base board 1 being apart in an amount corresponding to the thickness of a spacer 4. The hard mask 2, etc., are supported by a base board holder 3, and ahead of them a target electrode 5 to be provided with film shall be installed. The hard mask 2 has openings 21, 22 rectangular formed, wherein the one 21 in a region 2A has a smaller area than the other 22 in another region 2B, while the width of a framing part 23 is constant substantially, and the region 2A has smaller ratio of opening than the region 2B. Therefore, the film thickness 6a of that part of a conductive thin film 6 which mates with the region 2A becomes relatively thinner than the film thickness 6b of the part mating with the region 2B, and thereby a conductive thin film having a plurality of film thicknesses can be formed by a single film forming process. |
