发明名称 |
Method for producing a hybridization of detector array and integrated circuit for readout |
摘要 |
A process for fabricating a detector array in a layer of semiconductor material on one substrate and an integrated readout circuit in a layer of semiconductor material on a separate substrate in order to select semiconductor material for optimum performance of each structure, such as GaAs for the detector array and Si for the integrated readout circuit. The detector array layer is lifted off its substrate, laminated on the metallized surface of the integrated surface, etched with reticulating channels to the surface of the integrated circuit, and provided with interconnections between the detector array pixels and the integrated readout circuit through the channels. The adhesive material for the lamination is selected to be chemically stable to provide electrical and thermal insulation and to provide stress release between the two structures fabricated in semiconductor materials that may have different coefficients of thermal expansion.
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申请公布号 |
US5236871(A) |
申请公布日期 |
1993.08.17 |
申请号 |
US19920877966 |
申请日期 |
1992.04.29 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION |
发明人 |
FOSSUM, ERIC R.;GRUNTHANER, FRANK J. |
分类号 |
H01L21/762;H01L21/764;H01L21/8258;H01L27/146 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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