发明名称 WIRE BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To automatically extend a wire to the tip of a capillary when the wire is cut, to form a ball at the tip of the wire and to continue bonding. SOLUTION: An air tension part 5 is provided just above a wire clamp 1 and air is absorbed from the air supply discharge port of the air tension part 5. Thus, the wire 1 is fed out downward and conduction between the wire which is fed out from the tip of the capillary 2 and a discharge electrode 4 is detected. Then, a part between the tip of the wire 1 and the discharge electrode 4 is set to prescribed gap length. Even if the wire is cut during bonding, the wire 1 is automatically extended to the tip of the capillary 2, the ball is formed at the time of the wire 1 and bonding can be continued. Thus, effect that work efficiency improves is given.
申请公布号 JPH11233551(A) 申请公布日期 1999.08.27
申请号 JP19980048690 申请日期 1998.02.13
申请人 KAIJO CORP 发明人 MATSUMURA KATSUHIRO
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
代理机构 代理人
主权项
地址