| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of easily screening defective products. <P>SOLUTION: The method of manufacturing the semiconductor device comprises: a step of arranging multiple pellets 13 planarly for connection between a first lead frame plate 11a and a second lead frame plate 15a facing each other; a step of filling a resin 16 between the first lead frame plate 11a and the second lead frame plate 15a to seal the multiple pellets 13; a step of performing a first dicing process on a laminated body consisting of the first lead frame plate 11a, the resin 16, and the second lead frame plate 15a, between adjacent pellets 13, to separate at least the first lead frame plate 11a by cutting; a step of plating the laminated body from which at least the first lead frame plate 11a is separated by cutting; and a step of performing a second dicing process on the remainder of the laminated body, between adjacent pellets 13, to separate the laminated body into individual semiconductor devices 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
