| 摘要 |
<p>PURPOSE:To prevent the damage of an IC chip and the disconnection of a bonding wire even when a card base material receives bending or distortion by arranging a mold part to the section of the central part of an external terminal so as to position the same inside an insulating groove. CONSTITUTION:The IC chip 16 connected to a wiring electrode 14 by a bonding wire 15 is mounted on the rear of a substrate 11 at the position corresponding to the section of the central part of an external terminal 12. The bonding wire 15 and the IC chip 16 are protected by a mold part 17 covered with a resin. The mold part 17 is set to the size received inside the longitudinal insulating grooves 12a, 12a demarcating the ground terminal arranged to the center of the external terminal 12. Therefore, the bonding wire 15 and the IC chip 16 do not cross the longitudinal insulating grooves 12a, 12a.</p> |
