| 摘要 |
PURPOSE:To prevent defective bonding due to the vibration of the nose sections of inner leads by wire-bonding the inner leads and a chip under the state in which the chip is supported by a first tie bar connecting sections among the inner leads. CONSTITUTION:A chip on a bed 10 and the nose sections of inner leads 11 are wire-bonded, and a lead frame in a wire bonding region containing no first tie bar 12 is molded with a resin (a resin seal section 20). The first tie bars 12 are cut to mutually separate the inner leads 11, the whole containing the inner leads 11 except the wire bonding region is molded with the resin (a resin seal section 30), and second tie bars 14 are removed from outer leads 13, thus obtaining a resin seal type multi-pin type semiconductor device. Accordingly, the vibration of the nose sections of the inner leads 11 is inhibited by the first tie bars 12, and wire bonding is executed positively. |
