| 发明名称 |
Epoxy resin compositions and cured products thereof. |
| 摘要 |
<p>A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.</p> |
| 申请公布号 |
EP0488374(A2) |
申请公布日期 |
1992.06.03 |
| 申请号 |
EP19910120521 |
申请日期 |
1991.11.29 |
| 申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
SHIOBARA, TOSHIO;AOKI, TAKAYUKI;TOMIYOSHI, KAZUTOSHI;TSUCHIYA, TAKASHI |
| 分类号 |
C08G59/62;C08G59/00;C08G59/02;C08G59/14;C08G59/18;C08G59/32;C08G59/40;C08K5/5425;C08L63/00;C08L101/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/62 |
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