| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid-state imaging apparatus which is high in reliability and environment-resistivity and a method for manufacturing the solid-state imaging apparatus for protecting the surface of the solid-state imaging device. <P>SOLUTION: Protrudes 6 and 6 constituted of thermosetting resin are formed in the periphery of each of a plurality of solid-state imaging devices 3 and 3 formed on a silicon wafer 10, and the silicon wafer 10 whose periphery is formed with the protrudes 6 and 6 is loaded with a cover 4 in size opposite to the plurality of devices 3 and 3, and inputted to a vacuum chamber. Also, the silicon wafer 10 is heated to such a temperature that the protrudes 6 and 6 are hardened in a status that the pressure is reduced to a predetermined pressure in the vacuum chamber, and the cover 4 is bonded through the protrudes 6 and 6 to the silicon wafer 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
