| 摘要 |
1,235,413 Epoxy resin composition DEXTER CORP. 13 Jan., 1969 [26 Jan., 1968], No. 1985/69. Heading C3B. [Also in Division H1] A composition useful in the encapsulation of semi-conductors comprises, an uncured epoxy resin, an amine, anhydride or phenolic novolak curing agent and from 0�05-5% by weight, based on the total composition, of an alkylpolyalkoxy silane having an amine or epoxy substituent in the alkyl group; the alkyl and alkoxy groups each contain 1 to 6 carbon atoms. The silane may have the formula in which R<SP>1</SP> is C 1-3 alkyl, R<SP>2</SP> is C 1-3 alkyl or OR<SP>1</SP> and R<SP>3</SP> is a C 2-4 alkyl having an amine or epoxy substituent. Examples are # -(3,4 - epoxycyclohexyl)ethyltrimethoxysilane; y - glycidoxypropyltrimethoxysilane;γ-aminopropyltriethoxysilane and N - (# - aminoethyl) -γ- aminoisobutylmethyldimethoxysilane. The composition may also contain up to 70% by wt. of an inorganic filler, e.g. silica. The silane may be pre-coated on the filler prior to mixing with the epoxy resin. The composition may be a powder which may be fluidized and applied to a heated semi-conductor body. The silane may be pre-blended with the fluidized resin component. The composition may also be liquid and be prepared by bringing together, immediately prior to use, two liquid components in which the resin component (optionally containing filler pre-coated with silane) are kept apart from the curing agents. |
