| 摘要 |
A wafer processing method and a wafer processing apparatus are provided to reduce the time required for applying a die attachment paste on a back side of a wafer without using a die attachment film, since the die attachment paste is applied to the entire ground back side of the wafer by a single operation. A wafer processing method comprises the steps of: grinding a back side of a wafer(20) having a circuit pattern(C) on a front side; applying a die attachment paste(24) on the entire ground back side of the wafer; attaching a dicing tape on the applied die attachment paste; and dicing the wafer according to the circuit pattern. |
