| 摘要 |
A method of fabricating a photoplate and a photoplate fabricated by the method. A mask blank, having a glass substrate and an electrically conductive opaque film coating over an upper surface of the glass substrate, is coated with a resist to form a resist film over the opaque film to produce the photoplate. Before applying the resin to the opaque film (3), a zone of an upper surface of the opaque film (3) is deteriorated in wettability to the resist so that the resist does not adhere to the deteriorated wettability zone (3a), the deteriorated wettability zone (3a) being away from a pattern forming area (1a) of the opaque film (3). Then, the resist is applied over the upper surface of the opaque film (3) to form the resist film (4), whereby the wettability deteriorated zone (3a) of the opaque film (3) is exposed for earthing the opaque film (3), without being covered with the resist. |
