Apparatus for carrying out bonding at programmed positions of a circuit element and at corrected positions of leads therefor

摘要

In an automatic wire bonder, a rotatable work stage for a lead frame on which a plurality of leads are arranged and an electronic circuit element having a plurality of electrodes is mounted for rotation to align the circuit element in a predetermined direction. The angle of rotation is detected as an azimuthal error. A bonding tool is subsequently translated relative to the work stage to a position predetermined relative to the circuit element. The translation is detected as a positional error. Calculating means electrically calculates the relative positions of the leads using absolute positions of the leads and the azimuthal and positional errors. The bonding tool is driven responsive to the absolute positions of the electrodes and the relative positions of the leads to carry out the bonding process.