| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device and its manufacturing method using a coated bonding wire capable of efficiently performing wire bonding. SOLUTION: A coated bonding wire 13 has an amount of melting of a covered film 13 less than 300μm during the formation of a ball 13c due to electric sparks, and the core wire 13a of a coated resin can be protected at least from one of undesirable matters, filling-up of a resin, carbonization and sticking to a ball. The ball 13c is formed to a proper shape by electric spark at a time. A discharge time during ball formation is 0.5 to 3.0ms. |
