| 摘要 |
PURPOSE:To enhance the adhesion between a sealing resin and a lead frame by a method wherein a semiconductor element is mounted on the lead frame and is bonded, the lead frame is immersed in a silane coupling agent prior to a resin sealing operation and a coating is formed on the surface. CONSTITUTION:A lead-frame structure body is placed on a rack made of 'Teflon(R)'; the whole is immersed, for several seconds, in a primer solution in which several % of a silane coupling agent has been dissolved in hexane and isopropyl alcohol; after that, it is left at room temperature for 4 to 5 hours and is dried. A film 10 with a film thickness in the order of Angstrom is formed on the surface. During this process, it is arranged that a soldering region at tip parts of outer leads is not immersed in the silane coupling agent or that the region is immersed in a state covered with a mask. Then, a resin sealing operation is executed; the lead-frame structure body is sealed by excluding the tip parts of the outer leads. Accordingly, the silane coupling agent, a sealing resin and the surface of the lead frame are reacted; the sealing operation is executed in a state that an intermediate substance has been produced at an interface; as a result, the adhesion becomes extremely excellent. |
