| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting method of a semiconductor device capable of mounting at low cost and stably in quality. SOLUTION: In a mounting method for mounting a semiconductor chip 5 on which an electrode 6 having a metal film 7 containing one of gold, silver, platinum, or paradium on its surface is formed on a substrate 1, a solder bump 3 is formed on an electrode 2 of the substrate 1, the semiconductor chip 5 is mounted on the substrate 1, and the metal film 7 is pressed to joint the solder bump 3 to the electrode 6 with solder through heating. This enables low cost and stable mounting as compared to the prior method for forming solder bumps on the electrode 6 of the semiconductor chip 5.</p> |
