Low temperature curable adhesive compositions

摘要

The present disclosure is concerned with improved curable adhesive compositions for anchoring elements in a structural body that exhibit low temperature versus standard temperature degree of cures that are at least 50% or higher. The compositions include, in a first portion, a reactive resin, an acetoacetoxy functional monomer and a silane monomer. By using phthalate-free constituents in the formulation, a further 10% increase in strength and durability of the resins at standard temperatures may be realized after curing at low temperatures. Improvements in the adhesive compositions that relate to increased shelf life are also presented.

主权项

1. An improved curable adhesive composition, comprising:
a. at least one reactive resin comprising a polymerizable monomer; b. at least one acetoacetoxy functional monomer; c. at least one silane monomer; d. a free radical initiator; and e. an accelerant; in which the free radical initiator comprises dibenzoyl peroxide and at least one additional component selected from among anti-oxidants, stabilizers, non-reactive diluents, plasticizers, and combinations of any of the foregoing; and the accelerant is selected from the group consisting of N,N-diisopropanol-p-toluidine, N,N-dihydroxyethyl-p-toluidine, N,N-methylhydroxyethyl-p-toluidine, and mixtures thereof.