| 摘要 |
PURPOSE:To obtain high reliability of a resin-sealed type element by protecting the front surface and side surfaces of a semiconductor chip and also protecting wires connecting electrodes and inner leads with elastic resin. CONSTITUTION:A lead frame is formed in such a structure that partitioning walls 2 are formed at the four sides in the periphery of a die pad 1, slits 8 are formed in the periphery of the partioning walls 2 and die pad 1 and internal end portions 4 of inner lead 3 enter into the spaces of these slits 8. A semiconductor chip S is placed on this die pad 1, the electrodes thereof are connected with the internal end portions of inner lead 3 with wires 5, the insides of partitioning walls 2 are filled with elastic material 6 and moreover the entire part including the upper part of the elastic material 6 is sealed with a sealing resin. Since the front surface and side surfaces of semiconductor chip and wires are protected with elastic material, stress resulting from contraction of sealing resin can be dispersed. |
