| 摘要 |
PURPOSE:To eliminate a decrease in reliability of an integrated circuit device due to a stress of a hybrid integrated circuit device in which a semiconductor element is placed on a circuit board and which is sealed with a package resin layer. CONSTITUTION:A hybrid integrated circuit device has recesses 1a, 1b provided on a circuit board 1, a semiconductor element 4 placed in the recesses and sealed with a package resin layer 3. A through hole 8 to be externally opened is provided is a bottom of the recess 1b of the board, a stress to be generated at the layer 3 is released from the hole 8, a crack, etc., of the layer 3 is prevented, and deformation of the board 1 is prevented. |
