| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition that exhibits excellent heat resistance enough to endure reflow using Pb-free solder, give a highly rigid molded product and has an excellent molding cycle, and a manufacturing method of the molded product using the resin composition. SOLUTION: The resin composition comprises 100 pts.mass of a resin component comprised of a polyolefin resin and 1-200 pts.mass of a filler, where the polyolefin resin contains a cyclic olefin monomer unit, has a glass transition temperature higher than 120°C and gives, when crosslinked, a molded product having a storage elastic modulus of at least 1 MPa at 300°C. The manufacturing method of the molded product comprises using the resin composition. COPYRIGHT: (C)2008,JPO&INPIT
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