| 摘要 |
PURPOSE:To provide a die device which can be recovered after the mold release without causing warp, cracks, etc., on the surface of a package by providing a bore in the bottom of the generating face on the female mold side and arranging an ejector block which is movable vertically in the bore. CONSTITUTION:A resin-molding die device is provided with a male mold 4 and a female mold 3 provided with cavities 4a and 3a which can store a lead frame mounted with a chip, at least the female mold 3 of the male mold 4 and the female mold 3 is movable vertically, and molten resin is injected into the cavities 4a and 3a for molding. A bore 3b is provided in the bottom of the generating face on the side of the female mold 3 of the resin-molding die device and an ejector block 6 is arranged vertically movably in the bore 3b. Then, the ejector block 6 is connected with a shifter 5b, which absolutely stops regardless of the ascend/descend of the female mold 3, and the ejector block 6 allows the formation of a generating face that continuous from the surface of the cavity 3b at the time of joining the male mold 3 and the female mold 4. |
