摘要 |
PROBLEM TO BE SOLVED: To always level a plurality of bumps on an IC chip on a required level, without fail by merely inputting and setting the data on the manufacture lot of an IC chip, the descriptions, etc. SOLUTION: This device is equipped with a stage 12 which holds an IC chip 2, a leveler 19 which presses on each bump 1 at the same time, being arranged in parallel with the stage 12, a pressurizing means 17 which pressurizes the leveler 19 against each bump 1, a pressure detection means 10 which detects pressure to each bump 1 by the pressurizing means 17, and a pressure objective value setting means 21 which sets the objective pressure to the leveler 19 by the pressurizing means 17. The pressure of the pressurization means is fed back for control, based on the deviation between the pressure objective value and the detected value of the pressure by the pressurization means, so as to be the object pressure value set by an object pressure value setting means 21.
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