发明名称 Method of manufacturing electronic component
摘要 A manufacturing method for multi-layered electronic parts which is characterized in that from a roll of a polyethylene microporous sheet which has an electrode layer forming agent formed on its surface, contains 45 to 80 volume percent of inorganic filler, and has a thickness of 25 mum or less, tensile strengths of 3 kg/mm2 or more in the longitudinal direction and of 1 kg/mm2 or more in the transverse direction, and an elongation of 30% or less in the MD direction, layered electronic parts are formed via (a) a step of unwinding the sheet, (b) a step of cutting the sheet in a predetermined length, (c) a step of stacking the cut sheets, and (d) a step of cutting the layered structure and efficient production is made possible.
申请公布号 US6473950(B1) 申请公布日期 2002.11.05
申请号 US19980147424 申请日期 1998.12.21
申请人 TEIJIN LIMITED 发明人 KUMAKAWA SHIRO
分类号 H01G4/18;H01G4/20;(IPC1-7):H01G7/00;B32B27/38;H01G9/07 主分类号 H01G4/18
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