| 摘要 |
A lead frame is provided to remove a bus bar region and to reduce dimension of the lead frame by substituting the bus bar region with a lead lock implementing bus, ground, and power bar functions. A plurality of leads(15,16) are electrically connected to a semiconductor chip. A lead lock(20) includes a conductive base layer being laminated on upper portions of the leads, and an adhesive layer being laminated between the conductive base layer and the leads. The adhesive layer fixes the leads and attaches the conductive base layer to the leads. A circuit pattern is formed on a surface of the conductive base layer. The lead lock functions a bus, a ground, and a power bar, simultaneously. The lead lock further includes an insulating layer between the adhesive layer and the conductive base layer. The insulating layer is made by curing a portion of the adhesive layer. |
