发明名称 |
METHOD OF SELECTIVELY TREATING COPPER IN THE PRESENCE OF FURTHER METAL |
摘要 |
The present invention relates to a method of selectively treating the surface of copper or copper alloys without affecting other metals, particularly tin. The methods are suited for treating surfaces of copper or copper alloys in order to facilitate subsequent deposition of metal layers and enhance solderability of the surfaces of copper, copper alloys and said subsequently deposited metal layers. The methods are applied to printed circuit boards (PCBs) and lead frames or integrated circuit substrates (IC substrates). |
申请公布号 |
PH12016500496(A1) |
申请公布日期 |
2016.06.13 |
申请号 |
PH12016500496 |
申请日期 |
2016.03.14 |
申请人 |
ATOTECH DEUTCHLAND GMBH |
发明人 |
JANSSEN, BORIS ALEXANDER;BENDER, JEROME |
分类号 |
C11D11/00;C23C18/18;C23C18/54;C23F1/18;C23F1/34;C23F1/44;C23G1/10;C23G1/20;H01L21/3213;H05K3/06;H05K3/38 |
主分类号 |
C11D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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