发明名称 METHOD FOR LAMINATING BOARD AND LAMINATOR
摘要 <p>PROBLEM TO BE SOLVED: To protect a surface of a board coated with liquid-like resist. SOLUTION: A board 6 coated with liquid-like resist is prepared. A pair of protective films 4 each having a length exceeding the board 6 are prepared. Forward protruding parts to be opposed over a front end 6a of the board 6 of ends 4a of the pair of films 4 are temporarily press bonded to one another by temporarily attaching members 1. Simultaneously, adjacent parts of the protruding parts of the ends 4a of the films 4 are temporarily attached on the end 6a of the board 6. The board 6 of the state that the ends 4a of the films 4 are temporarily attached to the end 6a is passed from the end 6a side between a pair of press bonding rolls 2. Thus, the protruding parts of the ends 4a of the films 4 are press bonded to one another. Then, both surfaces of the board 6 are continuously laminated by the pair of films 4 from front end to rear end, and the rear protruding parts of the pair of films 4 to be opposed exceeding the rear end of the board 6 are press bonded to one another.</p>
申请公布号 JPH10337779(A) 申请公布日期 1998.12.22
申请号 JP19970147811 申请日期 1997.06.05
申请人 HAKUTO CO LTD;SANEE GIKEN KK 发明人 MIYAKE EIICHI
分类号 C08J7/04;B29C63/02;B29C65/00;B29C65/78;B29L9/00;B29L31/34;B32B37/10;B32B43/00;H05K3/00;(IPC1-7):B29C63/02;B32B31/20;B32B35/00 主分类号 C08J7/04
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