THE COMPOSITION OF HIGH HEAT DISSIPATIVE ADHESIVES

摘要

The present invention relates to an adhesive composite including high heat-radiation particles and an adhesive resin. The purpose of the present invention is to provide the high heat-radiation adhesive composite to prevent a decrease in energy efficiency and a decrease in the durability of an LED lamp caused by heat radiation of a joint of an LED package by using a high heat-radiation adhesive using expanded graphite which is a high conductive substance. To achieve the purpose, the high heat-radiation adhesive composite of the present invention may include the high heat-radiation particles and the adhesive resin. The high heat-radiation particles might be the expanded graphite. The expanded graphite might be modified by ultrasonic waves. In addition, a chemical functionalization group might be induced on a surface of the expanded graphite. In the present invention, the chemical functionalization group might be an oxygen-containing functional group.