RESIN SEALING TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent from exerting bad influence on an electrical characteristic and causing a crack due to heat at mounting and improve a dampproof characteristic by a method wherein a warp of a semiconductor element is made less after it is adhered and fixed. CONSTITUTION:An element mounting part 1 and a mounting supporting part 2 are formed with resins of a same kind as a sealing resin part 6. On one surface in which a semiconductor element 4 of the element mounting part 1 and the mounting supporting part 2 is not adhered, a silver plating layer 7 is formed with silver which is a material which is adhered to and connected to the sealing resin part 6.