| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink for semiconductor device, which can be taken out easily from a molding pot after being molded, and to prevent its molding method and molding apparatus. SOLUTION: On the side face of a heat sink 19 for semiconductor device produced by sintering a mixture of metal powder having a high thermal conductivity and powder of an inorganic compound having a low coefficient of thermal expansion, an inclining face 6b is formed so as to constitute a heat sink for semiconductor device having trapezoidal cross section, which facilitates taking out of the heat sink from a molding pot. In order to obtain the heat dissipater 19, an inclining part 6a which converges from the upper end 4 toward the bottom part 5 of a recess 3 in the molding pot 1 is formed between the upper end 4 and the bottom part 5.
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